Seeking a full time engineering position to apply my proficient skills and offer career growth.
Status
US Citizen
Education
University of Southern California, Los Angeles, CA.
Master of Science – Electrical Engineering May, 2006
GPA: 3.33
Bachelor of Science – Electrical Engineering May, 2005
GPA: 3.17
Experience
Foxconn / Hon Hai Logistics California LLC, Fullerton July, 07 – Present
· Hardware Engineer position in the Sony team under Engineering department.
· Work extensively with Sony VAIO Notebooks and desktops.
· Performing DMI and supporting BIOS flashing on VAIO motherboards.
· Contact Sony customers at San Diego directly about motherboard issues.
· Perform HP cell phone tests with Universal Radio Communicator Tester.
· Support other departments with computer hardware parts analysis.
· Calibrate test units in the warehouse.
· Follow ISO 9001:2000 standard procedures.
Logitech Far East LTD. Hsinchu, Taiwan July, 04 – Sept, 04
· Electrical Engineering intern Video Department in the Web Camera group.
· Soldered sample hardware for testing and development.
· Quality checked the sample web cameras using ESD.
· High voltage static shock test on the web cams.
· Performed USB cord analysis of the electromagnetic field using EFT/B.
· Analyzed various imaging products from Micron, Hynix, etc.
· Analyzed the result from horizontal and vertical EMI.
· Worked extensively with Sunplus and Micron Imaging sensors for PC web cam.
Course Work
Monolithic Microwave Integrated Circuit (MMIC) Design
· Led a team and designed driver amplifier in a transceiver.
· Produced 3-D and interface IC chip layouts which can be used for fabrication.
RF Communication & Hardware
· Design of modulator and demodulator, including FM and AM.
· Design of filters and amplifiers, including BPF, LPF, power amp, and LNA.
· Antenna and RF transceivers analysis.
Processing of Advanced Semiconductor Device
· Worked intensively with the Reactive Ion Etching machine in Clean Room.
VLSI CMOS Circuit Design
· Using Magic to layout VLSI circuitries and simulate it using Hspice and IRSIM.
Wireless Communication Link Budget
· Built a video conferencing link from LA to India.
· Analyzed SNR, Link Margin, full link budget and power consumption.
Solid State Processing and Integrated Circuit Laboratory
- Clean Room works to develop wafer patterns and Reactive Ion Etching.
Suspension of an Automobile: Linear System
- Design a suspension using Second Order system.
- Analyze result in Laplace and Fourier Transform with MATLAB.
Skills
Engineering: MATLAB, ePD, C++ Programming, Unix, Solaris, Xilinx
FPGA, Hspice, MAGIC VLSI layout, Eagle, Smith Chart, IRSIM,
Microwave Office.
Software: Photoshop, working knowledge of Mac OS, Windows
98/2000/XP, Microsoft Office, Microsoft Word, Typing skill.
Language: Fluent in Chinese and English; basic knowledge in Japanese.